TEA moudle: 132W
Size: 150x230x95mm
Heating side: skived fin heat sink
Cooling side: Liqud cooling plate
Fan : 8025 fan ,4500RPM,
Minimum cooling temperature: 5 degrees Celsius, under the condition of an ambient temperature of 35 degrees Celsius.
The TEA module we developed uses two 45×45 TEC chips, which are connected in series. This design results in an input voltage of 24 volts, helping to enhance the efficiency of intelligent chips.
To address the heat dissipation of intelligent chips, we adopt heat sink made through a skived fin process. Additionally, two heat pipes are arranged under the TEC chips to quickly conduct away a large amount of heat, which is then dissipated rapidly by an external fan. Moreover, insulating foam is placed between the hot side of the skived fin heat sink and the Liquid cooling plate cold side of the TEC to separate the hot and cold areas, preventing heat from transferring to the cooling side and reducing efficiency.
The ultimate design goal of this TEC module is to control the power at around 130 watts, and with its small size, it can maintain the temperature at approximately 55 degrees Celsius. This allows customers to use a water chiller to circulate coolant and keep it at 5 degrees Celsius, making the module suitable for applications in the medical industry and sensitive infrared camera chips, ensuring their stable operation.
We can customize the input voltage of 5V or 12V for customers, so that we can change the serial parallel mode of the chip. This customized design is only used by our company, which has 20 years of design experience in this field. We look forward to our cooperation starting.
